Quilt packaging

Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “nodule” structures that extend out horizontally from the edges of microchips to make electrically and mechanically robust chip-to-chip interconnections.

QP Chiplets can be quilted together in most any orientation.

QP nodules are created as an integral part of the microchip using standard back end of the line semiconductor device fabrication techniques. Solder is then electroplated on top of the nodules to enable the chip to chip interconnection with sub-micron alignment accuracy.

Small high yielding “chiplets” made from any semiconductor material (Silicon, Gallium Arsenide, Silicon Carbide, Gallium Nitride, etc.), can be “quilted” together to create larger multi-function meta-chip. Thus, QP technology can integrate multiple chips with dissimilar technologies or substrate materials in planar, 2.5D and 3D configurations.

This article is issued from Wikipedia. The text is licensed under Creative Commons - Attribution - Sharealike. Additional terms may apply for the media files.