Integrated circuit packaging

Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.

This article is about the final stage in the manufacturing process of integrated circuits. For an article about the physical enclosure that surrounds integrated circuits, see Semiconductor package.

The packaging stage is followed by testing of the integrated circuit.

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