Trimethylsilane
Trimethylsilane is the organosilicon compound with the formula (CH3)3SiH. It is a trialkylsilane. The Si-H bond is reactive. It is less commonly used as a reagent than the related triethylsilane, which is a liquid at room temperature.
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| Preferred IUPAC name
Trimethylsilane | |||
| Identifiers | |||
3D model (JSmol) |
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| ChemSpider | |||
| ECHA InfoCard | 100.012.366 | ||
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PubChem CID |
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CompTox Dashboard (EPA) |
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| Properties | |||
| C3H10Si | |||
| Molar mass | 74.198 g·mol−1 | ||
| Density | 0.638 g cm−3 | ||
| Melting point | −135.9 °C (−212.6 °F; 137.2 K) | ||
| Boiling point | 6.7 °C (44.1 °F; 279.8 K) | ||
| Hazards | |||
| GHS labelling: | |||
| Danger | |||
| H220, H224, H280, H315, H319, H335 | |||
| P210, P233, P240, P241, P242, P243, P261, P264, P271, P280, P302+P352, P303+P361+P353, P304+P340, P305+P351+P338, P312, P321, P332+P313, P337+P313, P362, P370+P378, P377, P381, P403, P403+P233, P403+P235, P405, P410+P403, P501 | |||
| NFPA 704 (fire diamond) | |||
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
Infobox references | |||
Trimethylsilane is used in the semiconductor industry as precursor to deposit dielectrics and barrier layers via plasma-enhanced chemical vapor deposition (PE-CVD). It is also used a source gas to deposit TiSiCN hard coatings via plasma-enhanced magnetron sputtering (PEMS). It has also been used to deposit silicon carbide hard coatings via low-pressure chemical vapor deposition (LP-CVD) at relatively low temperatures under 1000 °C. It is an expensive gas but safer to use than silane (SiH4); and produces properties in the coatings that cannot be undertaken by multiple source gases containing silicon and carbon.