Dichlorosilane
Dichlorosilane, or DCS as it is commonly known, is a chemical compound with the formula H2SiCl2. In its major use, it is mixed with ammonia (NH3) in LPCVD chambers to grow silicon nitride in semiconductor processing. A higher concentration of DCS·NH3 (i.e. 16:1), usually results in lower stress nitride films.
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| Names | |||
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| IUPAC name
Dichlorosilane | |||
| Other names
Silylene dichloride | |||
| Identifiers | |||
3D model (JSmol) |
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| Abbreviations | DCS | ||
| ChemSpider | |||
| ECHA InfoCard | 100.021.717 | ||
| EC Number |
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| MeSH | dichlorosilane | ||
PubChem CID |
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| RTECS number |
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| UN number | 2189 | ||
CompTox Dashboard (EPA) |
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| Properties | |||
| SiH 2Cl 2 | |||
| Molar mass | 101.007 g mol−1 | ||
| Appearance | Colourless gas | ||
| Density | 4.228 g cm−3 | ||
| Melting point | −122 °C (−188 °F; 151 K) | ||
| Boiling point | 8 °C; 46 °F; 281 K at 101 kPa | ||
| Reacts | |||
| Vapor pressure | 167.2 kPa (at 20 °C) | ||
| Thermochemistry | |||
Std molar entropy (S⦵298) |
286.72 J K−1 mol−1 | ||
Std enthalpy of formation (ΔfH⦵298) |
−320.49 kJ mol−1 | ||
| Hazards | |||
| GHS labelling: | |||
| Danger | |||
| H220, H250, H280, H314, H330 | |||
| P210, P261, P305+P351+P338, P310, P410+P403 | |||
| NFPA 704 (fire diamond) | |||
| Flash point | −37 °C (−35 °F; 236 K) | ||
| 55 °C (131 °F; 328 K) | |||
| Explosive limits | 4.1–99% | ||
| Safety data sheet (SDS) | inchem.org | ||
| Related compounds | |||
Related chlorosilanes |
Monochlorosilane Trichlorosilane | ||
Related compounds |
Dichloromethane | ||
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
Infobox references | |||
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