Wafer testing

Wafer testing is a step performed during semiconductor device fabrication after BEOL process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test patterns to them. The wafer testing is performed by a piece of test equipment called a wafer prober. The process of wafer testing can be referred to in several ways: Wafer Final Test (WFT), Electronic Die Sort (EDS) and Circuit Probe (CP) are probably the most common.