Thermal design power

The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload.

This article is about the thermal design envelope of microprocessors. For the general concept, see power rating.

Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating.

Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.

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